AT&S – EKF interview

AT&S – EKF interview

AT&S — 1 video in collection

AT&S manufactures high-end printed circuit boards and IC substrates at sites in Austria, China, India and Korea. It focuses on high-volume, high-density interconnect (HDI) boards used in mobile devices, specialist boards used in the automotive sector, and for healthcare products and industrial applications.

In this interview CEO Andreas Gerstenmayer gives an overview of the business and explains what is special about the group’s HDI circuit boards. He talks about how the diversity of the markets AT&S serves is currently benefitting the group and discusses the ongoing investment programme in IC substrate capacity. Finally, he explains why the group is investing to become a module integration services provider.


You may also be interested in these:

TMT

Quadient – executive interview

TMT

Noctiluca – equity proposition

Cookie Policy Overview
Edison Group

This website uses cookies so that we can provide you with the best user experience possible. Cookie information is stored in your browser and performs functions such as recognising you when you return to our website and helping us understand which section of the website you find more interesting and useful. See our Cookie Policy for more information.

Strictly necessary and functional

These cookies are used to deliver our website and content. Strictly necessary cookies relate to our hosting environment, and functional cookies are used to facilitate social logins, social sharing and rich-media content embeds.

Advertising

Advertising Cookies collect information about your browsing habits such as the pages you visit and links you follow. These audience insights are used to make our website more relevant.

Performance

Performance Cookies collect anonymous information designed to help us improve the site and respond to the needs of our audiences. We use this information to make our site faster, more relevant and improve the navigation for all users.