AT&S – EKF interview

Published on 9 November 2020

AT&S manufactures high-end printed circuit boards and IC substrates at sites in Austria, China, India and Korea. It focuses on high-volume, high-density interconnect (HDI) boards used in mobile devices, specialist boards used in the automotive sector, and for healthcare products and industrial applications.

In this interview CEO Andreas Gerstenmayer gives an overview of the business and explains what is special about the group’s HDI circuit boards. He talks about how the diversity of the markets AT&S serves is currently benefitting the group and discusses the ongoing investment programme in IC substrate capacity. Finally, he explains why the group is investing to become a module integration services provider.

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